What are the difficulties in making HDI PCB board？It can be elaborated from four aspects: HDI board material, interlayer connection, blind hole and line width & distance control. HDI PCB board is more and more favored to the market, and its production difficulty has also increased. It is of great significance to master the difficulty of production for improving production efficiency and ensuring product quality.

1. The difficulty of material production for HDI board

The structure of HDI PCB board is more complex than that of ordinary board, and the requirement of material properties are also higher. It requires to use materials that difficult to process, such as PTFE, PPO, PI and so on. These materials have chemical corrosion resistance, high strength, high temperature resistance and other characteristics, consequently the processing difficulty is also increased. In particular, it should be noted that the material processing is easy to produce thermal stress, surface coating rupture and other problems, which have a great impact on the quality of the plate.

• The difficulty of interlayer connection for HDI boards

In HDI design, there are many line layers and concentrated connection points. If all the connections are perforated, the perforation frequency will be too high, which will affect the stability of the line and the performance of the board. In this case, blind hole and buried hole technology should be used. But it is difficult and expensive to the buried holes. Blind holes need to rely on high-precision equipment such as laser drilling for processing, which is easy to produce poor perforation quality.

• The difficulty of making blind holes of HDI board

Making the blind holes demanding higher production technology, because it cannot be repaired after perforation, and once the quality is unqualified, a board needs to be re-made. Making the blind hole of HDI board requires three steps: drilling, then interface activation, and finally copper plating. Among these process, the accuracy of drilling is particularly high, while activation and copper plating require familiarity with the production process and ensure the quality of the finished product.

4. The line width and distance of the HDI board are difficult to control

The width and distance of the HDI board line are also difficult to make. There are many layers of HDI boards, and the line is becoming thinner and thinner. There are also strict requirements for the position, thickness and curved angle of the line, and the line accuracy will affect the electrical performance of the board. Many manufacturers must be equipped with miniature precision processing equipment, such as laser cutting machines, laser laser engraving machines, etc., in order to ensure that the line is produced in a high-precision range.

In general, the production difficulty of HDI PCB board is relatively high, mainly reflected in the material, interlayer connection, blind hole and line width and distance control. The production of HDI boards requires high-end processing equipment and fine manufacturing processes, and each production process has an important impact on the quality and performance of the board. Dinamike Solution keep strengthening the professional training and technical reserves of production engineers, improve the efficiency and quality of production, and meet the growing demand for HDI boards in the market.